 |
 |
|
|
| New
SITE tools in labs around the world |
 |
USA,
SpinBall combined coater/developer for sensor manufacturing
utilizing CAR (chemically amplified resist) |
 |
China,
bump technology packaging application using thick coatings with
multiple bake stations |
 |
Russia,
0.25 micron technology for microprocessors featuring bulkhead
configuration and integrated environmental control. |
 |
A new SITE Services 300mm SpinBall XP Combo with indexer located in a Silicon Valley manufacturing fab, helping produce custom and semi-custom integrated circuits.
|
|
| |
|
|
|
|
 |

|
 |